CX77304-15

Package Dimensions and Pin Descriptions

PA Module for Dual-Band GSM850 PCS1900 / GPRS Applications

101749A

Skyworks Solutions, Inc.

7

September 19, 2003

Proprietary Information

Package Dimensions and Pin Descriptions

Figure 2 is a mechanical diagram of the pad layout for the 16-pin leadless CX77304-15 dual-band

PA module. Figure 3 provides a recommended phone board layout footprint for the PAM to help

the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity

for the 50 ohm terminals.

Figure 4 shows the pin configuration and pin numbering convention, which starts with pin 1 in the

upper left, as indicated, and increments counter-clockwise around the package. Table 4 lists the pin

names and descriptions. Figure 5 interprets typical case markings.

Figure 2. CX77304-15 Package Dimensions–16-pin Module (All Views)

SIDE VIEW

TOP VIEW

BOTTOM VIEW

FRONT VIEW

R0.381 Typ

0.762 Typ

1.02 Typ

2.286

± 0.051

2.286

± 0.051

Pin 1

0.127 Ref

1.905

± 0.051

3.899

± 0.051

1.50 max.

R0.860 Typ

NOTE(S):

1. All contact points are gold plated, lead free-surfaces.

2. All dimensions are in millimeters.

9.10

+0.20/

-0.08

11.60 +0.20/-0.08

1.905

± 0.051

0.737 ± 0.051

101749_004