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X3G-OH047 Datenblatt(PDF) 9 Page - NXP Semiconductors |
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X3G-OH047 Datenblatt(HTML) 9 Page - NXP Semiconductors |
9 / 19 page X3G_T_OH047_048 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product specification Rev. 1 — 4 April 2011 9 of 19 NXP Semiconductors X3G-OH047/8; X3T-OH047/8 Magnetic field sensor 8. Packing information 8.1 Tape construction for X3G-OH047 and X3G-OH048 10 position pad 10 1842 95 m 11 position pad 11 2110 125 m 12 position pad 12 2242 200 m Table 8. Mechanical dimensions for Figure 6 …continued Symbol Parameter x y Radius/diameter Unit Table 9. Wafer dimensions Symbol Parameter Value Unit WD wafer diameter 150 mm WT wafer thickness 380 15 m Fig 7. Tape construction 019aab732 liner (PET) adhesive (acrylic) base film (PE) (38 μm) (10 μm) (65 μm) Table 10. Material composition Parameter Content Typical value Unit Total thickness - 75 m Adhesion - 55 / 20 g/mm Ionic impurity Na+ 0.027 g/ml K+ <0.004 g/ml Cl 0.045 g/ml |
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