Datenblatt-Suchmaschine für elektronische Bauteile |
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LM27262 Datenblatt(PDF) 9 Page - National Semiconductor (TI) |
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LM27262 Datenblatt(HTML) 9 Page - National Semiconductor (TI) |
9 / 22 page Electrical Characteristics (Note 5),(Note 6) V CC5V = 5V unless otherwise specified. (Continued) Symbol Parameter Conditions Min Typ Max Unit VRON De-assertion Delay Delay of VRON falling edge by the internal logic 50 nsec REFINT REFINT Leakage Current REFINT = 3.3V or GND ±2 µA Logic Low Input Voltage 0.5 V Logic High Input Voltage 3.0 V PHASES PHASES Leakage Current V PHASES =0V - 25 µA V PHASES = 3.3V 4 µA PHASES Open Circuit Voltage 10M Ω to Ground 2.8 V Logic Low Max Input Voltage 0.2 V Logic High Min Input Voltage Relative to Vcc (5V nominal) -0.2 V LOGIC OUTPUTS: DRIVEx Output High Voltage Output Source Current is 10 mA 3.5 V Output Source Current is 0 mA (no load) 4.5 Output Low Voltage Output Sink Current is 10 mA 0.3 V Low-to-High Transition Time 10% to 90% of V CC5V, C LOAD = 50pF 20 ns High-to-Low Transition Time 90% to 10% of V CC5V, C LOAD = 50pF 20 ns VIDPGD VIDPGD Output Max Low Voltage VIDPGD sinking 4mA (open drain) 0.17 0.25 V VIDPGD Leakage Current VIDPGD = 5.5V 1 10 µA VIDPGD Assertion Delay VRON assertion to VIDPGD assertion (SOFTCAP = 0.01µF) 2 ms VIDPGD De-assertion Delay VRON de-assertion to VIDPGD de-assertion 50 ns Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Note 2: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The 1.56W rating results from using 150˚C, 25˚C, and 80˚C/W for TJMAX,TA, and θJA respectively. The θJA of 90˚C/W represents the worst-case condition with no heat sinking of the 48-Pin TSSOP. Heat sinking allows the safe dissipation of more power. The Absolute Maximum power dissipation should be de-rated by 12.5mW per ˚C above 25˚C ambient. The LM27262 actively limits its junction temperature to about 165˚C. Note 3: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation. Note 4: For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5k Ω resistor. Note 5: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 6: A “typical” specification is the center of characterization data distribution taken with TA =TJ = 25˚C. Typical data are not guaranteed. www.national.com 9 |
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