MC10EP58, MC100EP58

http://onsemi.com

2

1

2

3

45

6

7

8

Q

VEE

VCC

Da

Q

Db

SEL

NC

1

0

MUX

Figure 1. 8–Lead Pinout (Top View) and Logic Diagram

PIN DESCRIPTION

PIN

Da*, Db*

ECL Select Inputs

FUNCTION

ECL Data Inputs

TRUTH TABLE

SEL

H

L

Data

a

b

SEL*

ECL Data Outputs

Negative Supply

Positive Supply

NC

VCC

VEE

No Connect

Q, Q

* Pins will default LOW when left open.

ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

75 k

W

Internal Input Pullup Resistor

N/A

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 4 kV

> 200 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1.)

Level 1

Flammability Rating

Oxygen Index

UL–94 code V–0 A 1/8”

28 to 34

Transistor Count

41 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

VCC

PECL Mode Power Supply

VEE = 0 V

6

V

VEE

NECL Mode Power Supply

VCC = 0 V

–6

V

VI

PECL Mode Input Voltage

VEE = 0 V

VI  VCC

6

V

VI

PECL Mode In ut Voltage

NECL Mode Input Voltage

VEE = 0 V

VCC = 0 V

VI  VCC

VI  VEE

6

–6

V

V

Iout

Output Current

Continuous

Surge

50

100

mA

mA

IBB

VBB Sink/Source

± 0.5

mA

TA

Operating Temperature Range

–40 to +85

°C

Tstg

Storage Temperature Range

–65 to +150

°C

θJA

Thermal Resistance (Junction to Ambient)

0 LFPM

500 LFPM

8 SOIC

8 SOIC

190

130

°C/W

°C/W

θJC

Thermal Resistance (Junction to Case)

std bd

8 SOIC

41 to 44

°C/W

θJA

Thermal Resistance (Junction to Ambient)

0 LFPM

500 LFPM

8 TSSOP

8 TSSOP

185

140

°C/W

°C/W

θJC

Thermal Resistance (Junction to Case)

std bd

8 TSSOP

41 to 44

°C/W

Tsol

Wave Solder

<2 to 3 sec @ 248

°C

265

°C

2. Maximum Ratings are those values beyond which device damage may occur.