Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74AUC126 Datenblatt(PDF) 1 Page - Texas Instruments |
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SN74AUC126 Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 7 page www.ti.com FEATURES RGY PACKAGE (TOP VIEW) 1 14 7 8 2 3 4 5 6 13 12 11 10 9 4OE 4A 4Y 3OE 3A 1A 1Y 2OE 2A 2Y DESCRIPTION/ORDERING INFORMATION SN74AUC126 QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SCES509 – NOVEMBER 2003 – REVISED DECEMBER 2005 • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation • Ioff Supports Partial-Power-Down Mode Operation • Sub 1-V Operable • Max tpd of 2.1 ns at 1.8 V • Low Power Consumption, 10- µA Max I CC • ±8-mA Output Drive at 1.8 V • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) This quadruple bus buffer gate is designed for 0.8-V to 2.7-V VCC operation, but is designed specifically for 1.6-V to 1.95-V VCC operation. The SN74AUC126 contains four independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is low. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING –40 °C to 85°C QFN – RGY Tape and reel SN74AUC126RGYR MS126 (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OUTPUT Y OE A H H H H L L L X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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