Datenblatt-Suchmaschine für elektronische Bauteile
  German  ▼
ALLDATASHEETDE.COM

X  

MCM63R918FC3.0R Datenblatt(PDF) 5 Page - Freescale Semiconductor, Inc

Teilenummer MCM63R918FC3.0R
Bauteilbeschribung  MCM63R836
Download  21 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Hersteller  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MCM63R918FC3.0R Datenblatt(HTML) 5 Page - Freescale Semiconductor, Inc

  MCM63R918FC3.0R Datasheet HTML 1Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 2Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 3Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 4Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 5Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 6Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 7Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 8Page - Freescale Semiconductor, Inc MCM63R918FC3.0R Datasheet HTML 9Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 5 / 21 page
background image
MCM63R836
•MCM63R918
5
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS, See Note)
Rating
Symbol
Value
Unit
Core Supply Voltage
VDD
–0.5 to 3.9
V
Output Supply Voltage
VDDQ
–0.5 to 2.5
V
Voltage On Any Pin Other Than JTAG
Vin
–0.5 to 2.5
V
Voltage On Any JTAG Pin
VJTAG
–0.5 to 3.9
V
Input Current (per I/O)
Iin
±50
mA
Output Current (per I/O)
Iout
±25
mA
Operating Temperature
TA
0 to 70
°C
Temperature Under Bias
Tbias
–10 to 85
°C
Storage Temperature
Tstg
–55 to 125
°C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.
PBGA PACKAGE THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (Still Air)
R
θJA
50
°C/W
1, 2
Junction to Ambient (@200 ft/min)
Single–Layer Board
R
θJA
39
°C/W
1, 2
Junction to Ambient (@200 ft/min)
Four–Layer Board
R
θJA
27
°C/W
3
Junction to Board (Bottom)
R
θJB
23
°C/W
4
Junction to Case (Top)
R
θJC
1
°C/W
5
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38–87.
3. Measured using a four–layer test board with two internal planes.
4. Indicates the average thermal resistance between the die and the printed circuit board as measured by the ring cold plate method.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC–883
Method 1012.1).
CLOCK TRUTH TABLE
K
ZZ
SS
SW
SBa
SBb
SBc
SBd
DQ (n)
DQ (n + 1)
Mode
L – H
L
L
H
X
X
X
X
X
Dout 0–35
Read Cycle All Bytes
L – H
L
L
L
L
H
H
H
High–Z
Din 0–8
Write Cycle 1st Byte
L – H
L
L
L
H
L
H
H
High–Z
Din 9–17
Write Cycle 2nd Byte
L – H
L
L
L
H
H
L
H
High–Z
Din 18 – 26
Write Cycle 3rd Byte
L – H
L
L
L
H
H
H
L
High–Z
Din 27 – 35
Write Cycle 4th Byte
L – H
L
L
L
L
L
L
L
High–Z
Din 0–35
Write Cycle All Bytes
L – H
L
L
L
H
H
H
H
High–Z
High–Z
Abort Write Cycle
L – H
L
H
H
X
X
X
X
X
High–Z
Deselect Cycle
L – H
L
H
L
X
X
X
X
High–Z
High–Z
Deselect Cycle
X
H
X
X
X
X
X
X
High–Z
High–Z
Sleep Mode
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised that
normal precautions be taken to avoid applica-
tion of any voltage higher than maximum rated
voltages to this high–impedance circuit.
This CMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.
This device contains circuitry that will ensure
the output devices are in High–Z at power up.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com


Ähnliche Teilenummer - MCM63R918FC3.0R

HerstellerTeilenummerDatenblattBauteilbeschribung
logo
Motorola, Inc
MCM63R836A MOTOROLA-MCM63R836A Datasheet
385Kb / 21P
   8M Late Write HSTL
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21


Datenblatt Download

Go To PDF Page


Link URL




Privatsphäre und Datenschutz
ALLDATASHEETDE.COM
War ALLDATASHEET hilfreich?  [ DONATE ] 

Über Alldatasheet   |   Werbung   |   Kontakt   |   Privatsphäre und Datenschutz   |   Linktausch   |   Hersteller
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com