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MCM63R918FC3.0R Datenblatt(PDF) 5 Page - Freescale Semiconductor, Inc |
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MCM63R918FC3.0R Datenblatt(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 21 page MCM63R836 •MCM63R918 5 MOTOROLA FAST SRAM ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS, See Note) Rating Symbol Value Unit Core Supply Voltage VDD –0.5 to 3.9 V Output Supply Voltage VDDQ –0.5 to 2.5 V Voltage On Any Pin Other Than JTAG Vin –0.5 to 2.5 V Voltage On Any JTAG Pin VJTAG –0.5 to 3.9 V Input Current (per I/O) Iin ±50 mA Output Current (per I/O) Iout ±25 mA Operating Temperature TA 0 to 70 °C Temperature Under Bias Tbias –10 to 85 °C Storage Temperature Tstg –55 to 125 °C NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPER- ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. PBGA PACKAGE THERMAL CHARACTERISTICS Rating Symbol Max Unit Notes Junction to Ambient (Still Air) R θJA 50 °C/W 1, 2 Junction to Ambient (@200 ft/min) Single–Layer Board R θJA 39 °C/W 1, 2 Junction to Ambient (@200 ft/min) Four–Layer Board R θJA 27 °C/W 3 Junction to Board (Bottom) R θJB 23 °C/W 4 Junction to Case (Top) R θJC 1 °C/W 5 NOTES: 1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38–87. 3. Measured using a four–layer test board with two internal planes. 4. Indicates the average thermal resistance between the die and the printed circuit board as measured by the ring cold plate method. 5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC–883 Method 1012.1). CLOCK TRUTH TABLE K ZZ SS SW SBa SBb SBc SBd DQ (n) DQ (n + 1) Mode L – H L L H X X X X X Dout 0–35 Read Cycle All Bytes L – H L L L L H H H High–Z Din 0–8 Write Cycle 1st Byte L – H L L L H L H H High–Z Din 9–17 Write Cycle 2nd Byte L – H L L L H H L H High–Z Din 18 – 26 Write Cycle 3rd Byte L – H L L L H H H L High–Z Din 27 – 35 Write Cycle 4th Byte L – H L L L L L L L High–Z Din 0–35 Write Cycle All Bytes L – H L L L H H H H High–Z High–Z Abort Write Cycle L – H L H H X X X X X High–Z Deselect Cycle L – H L H L X X X X High–Z High–Z Deselect Cycle X H X X X X X X High–Z High–Z Sleep Mode This device contains circuitry to protect the inputs against damage due to high static volt- ages or electric fields; however, it is advised that normal precautions be taken to avoid applica- tion of any voltage higher than maximum rated voltages to this high–impedance circuit. This CMOS memory circuit has been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. This device contains circuitry that will ensure the output devices are in High–Z at power up. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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