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HCPL-655K Datenblatt(PDF) 6 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL-655K
Bauteilbeschribung  Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-655K Datenblatt(HTML) 6 Page - Agilent(Hewlett-Packard)

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6
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel
product in 8 and 16 pin DIP. DSCC drawing part numbers contain provisions for lead finish. All
leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option
is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
This option has solder dipped leads.
Hermetic Optocoupler Options
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5˚ MAX.
4.57 (0.180)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)


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