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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 05 — 10 February 2005

3 of 15

Philips Semiconductors

74LVT125

3.3 V quad buffer; 3-state

6.

Pinning information

6.1 Pinning

6.2 Pin description

(1) The die substrate is attached to the

exposed die pad using conductive die

attach material. It can not be used as

a supply pin or input.

Fig 4.

Pin configuration SO14, SSOP14

and TSSOP14

Fig 5.

Pin configuration DHVQFN14

125

1OE

1A

4OE

1Y

4A

2OE

4Y

2A

3OE

2Y

3A

GND

3Y

001aac476

1

2

3

4

5

6

7

8

10

9

12

11

14

13

001aac477

125

Transparent top view

2Y

3A

2A

3OE

2OE

4Y

1Y

4A

1A

4OE

6

9

5

10

4

11

3

12

2

13

terminal 1

index area

Table 3:

Pin description

Symbol

Pin

Description

1OE

1

1 output enable input (active LOW)

1A

2

1 data input

1Y

3

1 data output

2OE

4

2 output enable input (active LOW)

2A

5

2 data input

2Y

6

2 data output

GND

7

ground (0 V)

3Y

8

3 data output

3A

9

3 data input

3OE

10

3 output enable input (active LOW)

4Y

11

4 data output

4A

12

4 data input

4OE

13

4 output enable input (active LOW)

14

supply voltage