Datenblatt-Suchmaschine für elektronische Bauteile |
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MC74LVX50DTR2 Datenblatt(PDF) 3 Page - ON Semiconductor |
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MC74LVX50DTR2 Datenblatt(HTML) 3 Page - ON Semiconductor |
3 / 10 page MC74LVX50 http://onsemi.com 3 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VIN DC Input Voltage *0.5 to )7.0 V VOUT DC Output Voltage *0.5 to VCC )0.5 V IIK DC Input Diode Current VI < GND *20 mA IOK DC Output Diode Current VO < GND $20 mA IOUT DC Output Sink Current $25 mA ICC DC Supply Current per Supply Pin $50 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature under Bias )150 _C qJA Thermal Resistance (Note 1) SOIC TSSOP 125 170 _C/W MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL 94−V0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 2000 V ILatchup Latchup Performance Above VCC and Below GND at 85_C (Note 5) $300 mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Supply Voltage 2.0 3.6 V VI Input Voltage (Note 6) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V TA Operating Free−Air Temperature *40 )85 _C Dt/DV Input Transition Rise or Fall Rate VCC = 3.0 V $0.3 V 0 100 ns/V 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. NOTE: The qJA of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table and figure below. |
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