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MC74LVX50DTR2 Datenblatt(PDF) 3 Page - ON Semiconductor

Teilenummer MC74LVX50DTR2
Bauteilbeschribung  HEX BUFFER
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
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MC74LVX50
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to )7.0
V
VOUT
DC Output Voltage
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
VI < GND
*20
mA
IOK
DC Output Diode Current
VO < GND
$20
mA
IOUT
DC Output Sink Current
$25
mA
ICC
DC Supply Current per Supply Pin
$50
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature under Bias
)150
_C
qJA
Thermal Resistance
(Note 1)
SOIC
TSSOP
125
170
_C/W
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 30% − 35%
UL 94−V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
2000
V
ILatchup
Latchup Performance
Above VCC and Below GND at 85_C (Note 5)
$300
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Supply Voltage
2.0
3.6
V
VI
Input Voltage
(Note 6)
0
5.5
V
VO
Output Voltage
(HIGH or LOW State)
0
VCC
V
TA
Operating Free−Air Temperature
*40
)85
_C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.0 V $0.3 V
0
100
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NOTE:
The
qJA of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table
and figure below.


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