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AG303-86-RFID Datenblatt(PDF) 5 Page - WJ Communication. Inc.

Teilenummer AG303-86-RFID
Bauteilbeschribung  InGaP HBT Gain Block
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Hersteller  WJCI [WJ Communication. Inc.]
Direct Link  http://www.wj.com
Logo WJCI - WJ Communication. Inc.

AG303-86-RFID Datenblatt(HTML) 5 Page - WJ Communication. Inc.

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Specifications and information are subject to change without notice
WJ Communications, Inc
• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
Page 5 of 6 June 2005
AG303-86
InGaP HBT Gain Block
Product Information
AG303-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
°C
Thermal Resistance, Rth (1)
335
°C/W
Junction Temperature, Tjc (2)
135
°C
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85
°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
°C.
Product Marking
The component will be marked with an “E”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes at 1000 V min.
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Level 4
Value:
Passes at 1000 V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.


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