Datenblatt-Suchmaschine für elektronische Bauteile |
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AG303-86-RFID Datenblatt(PDF) 5 Page - WJ Communication. Inc. |
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AG303-86-RFID Datenblatt(HTML) 5 Page - WJ Communication. Inc. |
5 / 6 page Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 6 June 2005 AG303-86 InGaP HBT Gain Block Product Information AG303-86 (SOT-86 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth (1) 335 °C/W Junction Temperature, Tjc (2) 135 °C 1. The thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. This corresponds to the typical biasing condition of +4.23V, 35 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 °C. Product Marking The component will be marked with an “E” designator followed by a two-digit numeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1C Value: Passes at 1000 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Level 4 Value: Passes at 1000 V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 1 Standard: JEDEC Standard J-STD-020A Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. |
Ähnliche Teilenummer - AG303-86-RFID |
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Ähnliche Beschreibung - AG303-86-RFID |
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