Datenblatt-Suchmaschine für elektronische Bauteile
Selected language     German  ▼
Bauteilbezeichnung
         Beschreibung


ADA4922-1 Datenblatt(Datasheet) 5 Page - Analog Devices

Teile-Nr. ADA4922-1
Beschreibung  High Voltage, Differential 18-Bit ADC Driver
Download  20 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Hersteller  AD [Analog Devices]
Homepage  http://www.analog.com
Logo 

 
 5 page
background image
ADA4922-1
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
26 V
Power Dissipation
See Figure 3
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature Range (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in the circuit board with its
exposed paddle soldered to a pad on the PCB surface that is
thermally connected to a copper plane, with zero airflow.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC with EP on 4-layer board
79
25
°C/W
8-Lead LFCSP with EP on 4-layer board
81
17
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4922-1
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4922-1. Exceeding a
junction temperature of 150°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The power dissipated due to the load
drive depends upon the particular application. For each output,
the power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to all of the loads is equal to the sum of
the power dissipation due to each individual load. RMS voltages
and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA. The exposed paddle on the underside of the
package must be soldered to a pad on the PCB surface that is
thermally connected to a copper plane to achieve the specified θJA.
Figure 3 shows the maximum safe power dissipation in the
packages vs. the ambient temperature for the 8-lead SOIC
(79°C/W) and for the 8-lead LFCSP (81°C/W) on a JEDEC
standard 4-layer board, each with its underside paddle soldered
to a pad that is thermally connected to a PCB plane. θJA values
are approximations.
3.0
0
–40
80
AMBIENT TEMPERATURE (
°C)
2.5
2.0
1.5
1.0
0.5
–20
0
20
40
60
SOIC
LFCSP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.




Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20 


Datasheet Download



verwandte Bauteile- Teilenummer

TeilenummerBauteilebeschreibungHtml ViewHersteller
LT6402-20300MHz Low Distortion Low Noise Differential Amplifier/ ADC Driver AV = 20dB 1 2 3 4 5 MoreLinear Technology
AD798218-bit 1 MSPS PulSAR ADC in MSOP/QFN 1 2 3 4 5 MoreAnalog Devices
HVP050P5000High Voltage Power Supply - 250W Series 1 2 Voltage Multipliers Inc.
AD767418-Bit 2.5 LSB INL 800 kSPS SAR ADC 1 2 3 4 5 MoreAnalog Devices
ADA4899-1Unity Gain Stable Ultralow Distortion 1 nV/ Hz Voltage Noise High Speed Op Amp 1 2 3 4 5 MoreAnalog Devices
SN74SSTE3288228-Bit to 56-Bit Registered Buffer With Address Parity Test and One Pair to Four Pair Differential Clock PLL Driver 1 2 3 4 5 MoreTexas Instruments
PI1748DG-22HHIGH POWER DROP-IN ISOLATOR 1 PREMIER DEVICES, INC.
ZL5006216K-Channel Digital Switch with High Jitter Tolerance Single Rate 2 4 8 or 16Mbps and 64 Inputs and 64 Outputs 1 2 3 4 5 MoreZarlink Semiconductor Inc
NLAST9431Low Voltage Single Supply Dual DPDT Analog Switch 1 2 3 4 5 MoreON Semiconductor
PI1748DG-41HHIGH POWER DROP-IN ISOLATOR 1 PREMIER DEVICES, INC.

Link URL

War ALLDATASHEET hilfreich?  [ Spenden ]  

Über ALLDATASHEET   |   Werbung   |   Kontakt   |   Privatsphäre und Datenschutz   |   Lesezeichen hinzufügen   |   Linktausch   |   Hersteller
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl