ADP1621 datasheet(5/32 Pages) AD

Teilenummer	ADP1621

Bauteilbeschribung	Constant-Frequency, Current-Mode Step-Up DC/DC Controller

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Hersteller	AD [Analog Devices]

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ADP1621

Rev. A | Page 5 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN to GND

−0.3 V to VSHUNT

FB, COMP, SDSN, FREQ, GATE to GND

−0.3 V to (VIN + 0.3 V)

CS to GND

−5 V to +33 V

PIN to PGND

−0.3 V to VSHUNT

Supply Current into IN

25 mA

Supply Current into PIN

35 mA

Storage Temperature Range

−55°C to +150°C

Junction Operating Temperature Range1

−55°C to +150°C

Junction Storage Temperature Range

−55°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Package Power Dissipation1

(TJ,MAX − TA)/θJA

1In applications where high power dissipation and poor package thermal

resistance are present, the maximum ambient temperature may need to be

derated. Maximum ambient temperature (TA,MAX) is dependent on the

maximum operating junction temperature (TJ,MAX = 150oC), the maximum

power dissipation of the device in the application (PD,MAX), and the junction-

to-ambient thermal resistance of the package in the application (θJA), is given

by the following equation: TA,MAX = TJ,MAX --- (θJA x PD,MAX).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

10-lead MSOP on a 2-layer PCB

200

°C/W

10-lead MSOP on a 4-layer PCB

172

°C/W

Junction-to-ambient thermal resistance of the package is based

on modeling and calculation using 2-layer and 4-layer boards,

and natural convection. The junction-to-ambient thermal

resistance is application- and board-layout dependent. In

applications where high maximum power dissipation exists,

attention to thermal dissipation issues in board design is

required.

ESD CAUTION

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