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TDA8742H Datenblatt(PDF) 3 Page - NXP Semiconductors |
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TDA8742H Datenblatt(HTML) 3 Page - NXP Semiconductors |
3 / 21 page October 1994 3 Philips Semiconductors Product specification Satellite sound circuit with noise reduction TDA8742; TDA8742H ORDERING INFORMATION Note 1. When using IR reflow soldering it is recommended that the Drypack instructions in the “Quality Reference Handbook” (order number 9398 510 63011) are followed. BLOCK DIAGRAM TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA8742 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 TDA8742H QFP44(1) plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm SOT307-2 Fig.1 Block diagram. The pin numbers in parenthesis refer to the QFP44 package. |
Ähnliche Teilenummer - TDA8742H |
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Ähnliche Beschreibung - TDA8742H |
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