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DAC8802IPW Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer DAC8802IPW
Bauteilbeschribung  Dual, Serial Input 14-Bit Multiplying Digital-to-Analog Converter
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
DAC8802
SBAS351A – AUGUST 2005 – REVISED DECEMBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
MINIMUM
RELATIVE
DIFFERENTIAL
SPECIFIED
TRANSPORT
ACCURACY
NONLINEARITY
TEMPERATURE
PACKAGE-
PACKAGE
ORDERING
MEDIA,
PRODUCT
(LSB)
(LSB)
RANGE
LEAD
DESIGNATOR
NUMBER
QUANTITY
DAC8802IPW
Tubes, 90
DAC8802
±1
±1
–40°C to +85°C
TSSOP-16
PW
DAC8802IPWR
Tape and Reel, 2500
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or
see the TI website at www.ti.com.
DAC8802
UNIT
VDD to GND
–0.3 to +8
V
VREF to GND
–18 to +18
V
Logic inputs and output to GND
– 0.3 to + 8
V
V(IOUT) to GND
– 0.3 to VDD + 0.3
V
AGNDX to DGND
–0.3 to +0.3
V
Input current to any pin except supplies
±50
mA
Package power dissipation
(TJmax – TA)/θJA
W
Thermal resistance,
θ
JA
100
°C/W
Maximum junction temperature (TJmax)
150
°C
Operating temperature range
– 40 to +85
°C
Storage temperature range
– 65 to + 150
°C
(1)
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2


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