Datenblatt-Suchmaschine für elektronische Bauteile |
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LM2694SD Datenblatt(PDF) 3 Page - National Semiconductor (TI) |
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LM2694SD Datenblatt(HTML) 3 Page - National Semiconductor (TI) |
3 / 19 page Pin Descriptions PIN NUMBER NAME DESCRIPTION APPLICATION INFORMATION LLP-10 TSSOP-14 1 2 SW Switching Node Internally connected to the buck switch source. Connect to the inductor, free-wheeling diode, and bootstrap capacitor. 2 3 BST Boost pin for bootstrap capacitor Connect a 0.022 µF capacitor from SW to the BST pin. The capacitor is charged from VCC via an internal diode during the buck switch off-time. 3 4 ISEN Current sense During the buck switch off-time, the inductor current flows through the internal sense resistor, and out of the ISEN pin to the free-wheeling diode. The current limit is nominally set at 0.62A. 4 5 SGND Current Sense Ground Re-circulating current flows into this pin to the current sense resistor. 5 6 RTN Circuit Ground Ground return for all internal circuitry other than the current sense resistor. 6 9 FB Voltage feedback input from the regulated output Input to both the regulation and over-voltage comparators. The FB pin regulation level is 2.5V. 7 10 SS Softstart An internal current source charges the SS pin capacitor to 2.5V to soft-start the reference input of the regulation comparator. 8 11 RON/SD On-time control and shutdown An external resistor from VIN to the RON/SD pin sets the buck switch on-time. Grounding this pin shuts down the regulator. 9 12 VCC Output of the startup regulator The voltage at VCC is nominally regulated at 7V. Connect a 0.1 µF, or larger capacitor from VCC to ground, as close as possible to the pins. An external voltage can be applied to this pin to reduce internal dissipation. MOSFET body diodes clamp VCC to VIN if V CC > VIN. 10 13 VIN Input supply voltage Nominal input range is 8V to 30V. Input bypass capacitors should be located as close as possible to the VIN pin and RTN pins. 1,7,8,14 NC No connection. No internal connection. Can be connected to ground plane to improve heat dissipation. EP EP Exposed Pad Exposed metal pad on the underside of the LLP package. It is recommended to connect this pad to the PC board ground plane to aid in heat dissipation. www.national.com 3 |
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Ähnliche Beschreibung - LM2694SD |
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