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MC100LVE310FN Datenblatt(PDF) 6 Page - ON Semiconductor

Teilenummer MC100LVE310FN
Bauteilbeschribung  3.3V ECL 2:8 Differential Fanout Buffer
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MC100LVE310FN Datenblatt(HTML) 6 Page - ON Semiconductor

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MC100LVE310
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6
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
−N−
−M−
−L−
V
W
D
D
Y BRK
28
1
VIEW S
S
L−M
S
0.010 (0.250)
N S
T
S
L−M
M
0.007 (0.180)
N S
T
0.004 (0.100)
G1
G
J
C
Z
R
E
A
SEATING
PLANE
S
L−M
M
0.007 (0.180)
N S
T
−T−
B
S
L−M
S
0.010 (0.250)
N S
T
S
L−M
M
0.007 (0.180)
N S
T
U
S
L−M
M
0.007 (0.180)
N S
T
Z
G1
X
VIEW D−D
S
L−M
M
0.007 (0.180)
N S
T
K1
VIEW S
H
K
F
S
L−M
M
0.007 (0.180)
N S
T
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.485
0.495
12.32
12.57
B
0.485
0.495
12.32
12.57
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
−−−
0.51
−−−
K
0.025
−−−
0.64
−−−
R
0.450
0.456
11.43
11.58
U
0.450
0.456
11.43
11.58
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
−−−
0.020
−−−
0.50
Z
2
10
2
10
G1
0.410
0.430
10.42
10.92
K1
0.040
−−−
1.02
−−−
__
__


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