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MC100LVEL33MNR4G Datenblatt(PDF) 2 Page - ON Semiconductor

Teilenummer MC100LVEL33MNR4G
Bauteilbeschribung  3.3V ECL 첨4 Divider
Download  8 Pages
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100LVEL33MNR4G Datenblatt(HTML) 2 Page - ON Semiconductor

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MC100LVEL33
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2
Figure 1. Logic Diagram and Pinout Assignment
4
3
1
2
5
6
7
8
Q
VEE
VCC
Q
CLK
VBB
R
÷4
Reset
CLK
CLK*, CLK**
ECL Differential Clock Inputs
Q, Q
ECL Differential Data ÷4 Outputs
Reset*
ECL Asynch Reset
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
Table 1. PIN DESCRIPTION
PIN
FUNCTION
* Pins will default LOW when open due to internal 75 kW
resistor to VEE
** Pins will default to 1/2 VCC when open due to internal
resistors: 75 kW to VEE and 75 kW to VCC
EP
Exposed pad must be connected
to a sufficient thermal conduit.
Electrically connect to the most
negative supply or leave floating
open.
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6 to 0
−6 to 0
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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