Datenblatt-Suchmaschine für elektronische Bauteile |
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BYG50G Datenblatt(PDF) 4 Page - NXP Semiconductors |
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BYG50G Datenblatt(HTML) 4 Page - NXP Semiconductors |
4 / 6 page 1996 May 24 4 Philips Semiconductors Preliminary specification Controlled avalanche rectifiers BYG50 series GRAPHICAL DATA Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57. handbook, halfpage 0 160 200 0 MBH396 2 1 4 3 80 120 40 Ttp (°C) IF(AV) (A) Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57. Device mounted as shown in Fig.7 Solid line: Al2O3 PCB; dotted line: epoxy PCB. handbook, halfpage 0 160 200 0 MBH397 0.8 1.2 0.4 2.0 1.6 80 120 40 Tamb (°C) IF(AV) (A) Device mounted as shown in Fig.7. Solid line: Al2O3 PCB. Dotted line: epoxy PCB. Fig.4 Maximum permissible junction temperature as a function of reverse voltage. handbook, halfpage 200 Tj ( °C) 0 400 1200 0 MGD483 800 VR (V) 40 DG J K M 80 120 160 Solid line: Tj =25 °C. Dotted line: Tj = 175 °C. Fig.5 Forward current as a function of forward voltage; maximum values. handbook, halfpage 0 1.6 2.0 0 MBH398 4 6 2 10 8 0.8 1.2 0.4 VF (V) IF (A) |
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