AD8092ARZ-REEL datasheet(8/20 Pages) AD

Teilenummer	AD8092ARZ-REEL

Bauteilbeschribung	Low Cost, High Speed Rail-to-Rail Amplifiers

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Hersteller	AD [Analog Devices]

Direct Link	http://www.analog.com

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A8091/AD8092

Rev. B | Page 8 of 20

Airflow increases heat dissipation, effectively reducing θJA. Also,

more metal directly in contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the θJA. Care must be taken to minimize parasitic capacitances

at the input leads of high speed op amps as discussed in the

board layout section.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the SOIC-8

(125°C/W), SOT23-5 (180°C/W), and MSOP-8 (150°C/W) on a

JEDEC standard four-layer board.

2.0

0

0.5

1.0

1.5

–40 –30 –20 –10

0

102030

405060

708090

AMBIENT TEMPERATURE (

°C)

TJ = 150°C

MSOP-8

SOIC-8

SOT23-5

Figure 4. Maximum Power Dissipation vs.

Temperature for a Four-Layer Board

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