© 2006 Fairchild Semiconductor 2006

www.fairchildsemi.com

FAN5033 Rev. 1.0.0

5 of 39

Absolute Maximum Rating

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Unless otherwise specified, all other voltages are referenced to GND.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage

-0.3

+15

V

FBRTN

-0.3

+0.3

V

RAMPADJ, PWM3

-0.3

V

SW1 – SW3

-10

+25

V

All Other Inputs and Outputs

-0.3

+5.5

V

Operating Junction Temperature

0

+125

°C

Storage Temperature

-65

+150

°C

Lead Soldering Temperature (10 seconds)

300

°C

Lead Infrared Temperature (15 seconds)

260

°C

Thermal Resistance Junction-to-Ambient

(1)

45

°C/W

Note:

1.

Junction-to-ambient thermal resistance,

number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat

sink characteristics.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage, VCC to GND

9.6

12

14.4

V

Ambient Temperature

0

+85

°C