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L6701TR Datenblatt(PDF) 7 Page - STMicroelectronics |
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L6701TR Datenblatt(HTML) 7 Page - STMicroelectronics |
7 / 44 page L6701 2 Pins description and connection diagrams 7/44 19 REF_IN Reference Input for the regulation. Connect directly or through a resistor to the REF_OUT pin. See Section 10.3 for details. This pin is used as input for the protections. 20 REF_OUT Reference Output. Connect directly or through a resistor to the REF_IN pin. See Section 10.3 for details. 21 to 26 VID4 to VID0, VID5 Voltage IDentification Pins. Internally pulled up by 12.5µA to 5V, connect to SGND to program a '0' or leave floating to program a '1'. They allow programming output voltage as specified in Table 5, Table 6 and Table 7 according to DAC_SEL status. 27 FBR Remote Buffer Non Inverting Input. Connect to the positive side of the load to perform remote sense. See Section 16 for proper layout of this connection. 28 FBG Remote Buffer Inverting Input. Connect to the negative side of the load to perform remote sense. See Section 16 for proper layout of this connection. 29 to 31 ISEN3 to ISEN1 LS Current Sense Pins. These pins are used for current balance phase-to-phase as well as for the system OCP. Connect through a resistor RISEN to the relative PHASEx pin. See Section 9 and Section 13.6 for details. 32 CS+ Droop Current Sense non-inverting input. Connect through RPH-CPH network to the main inductors. Directly connect to output voltage when Droop function is not required. See Section 10.1 and Section 10.2 for details. 33 CS- Droop Current Sense inverting input. Connect through resistor RD to the main inductors common node. Leave floating when Droop Function is not required. See Section 10.1 and Section 10.2 for details. This pin also monitors the output for any feedback disconnection. See Section 13.4 for details. 34 VSEN Remote Buffer Output. It manages OVP and UVP protections and PGOOD (when applicable). See Section 13 for details. 35 FB Error Amplifier Inverting Input. Connect with a resistor RFB vs. VSEN and with an RF - CF toward COMP. 36 COMP Error Amplifier Output. Connect with an RF - CF vs. FB. The device cannot be disabled by pulling down this pin. PAD THERMAL PAD Thermal pad connects the Silicon substrate and makes good thermal contact with the PCB to dissipate the power necessary to drive the external MOSFETs. Connect to the PGND plane with several VIAs to improve thermal conductivity. Table 1. Pins description (continued) Pin n ° Name Function |
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