Datenblatt-Suchmaschine für elektronische Bauteile |
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FDS6670A Datenblatt(PDF) 2 Page - Fairchild Semiconductor |
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FDS6670A Datenblatt(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDS6670A Rev F (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 30 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 26 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1 µA VDS = 24 V, VGS = 0 V, TJ=55 °C 10 µA IGSS Gate–Body Leakage VGS = ±20 V, V DS = 0 V ±100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1 1.8 3 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C –5.3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = 10 V, ID = 13 A VGS = 4.5 V, ID = 10.5 A VGS= 10 V, ID = 13 A, TJ=125 °C 6 7.2 8.5 8 10 14 m Ω ID(on) On–State Drain Current VGS = 10 V, VDS = 5 V 50 A gFS Forward Transconductance VDS = 15 V, ID = 13 A 55 S Dynamic Characteristics Ciss Input Capacitance 2220 pF Coss Output Capacitance 535 pF Crss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 200 pF RG Gate Resistance VGS = 15 mV, f = 1.0 MHz 1.7 Ω Switching Characteristics (Note 2) td(on) Turn–On Delay Time 11 19 ns tr Turn–On Rise Time 13 24 ns td(off) Turn–Off Delay Time 40 64 ns tf Turn–Off Fall Time VDD = 10 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 13 24 ns Qg Total Gate Charge 21 30 nC Qgs Gate–Source Charge 6 nC Qgd Gate–Drain Charge VDS = 15 V, ID = 13 A, VGS = 5 V 7 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 2.1 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 2.1 A (Note 2) 0.7 1.2 V trr Diode Reverse Recovery Time 31 nS Qrr Diode Reverse Recovery Charge IF = 13 A, diF/dt = 100 A/µs 21 nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°C/W when mounted on a 1in 2 pad of 2 oz copper b) 125°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2 Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
Ähnliche Teilenummer - FDS6670A_03 |
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Ähnliche Beschreibung - FDS6670A_03 |
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