Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74AUP1G74YEPR Datenblatt(PDF) 1 Page - Texas Instruments |
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SN74AUP1G74YEPR Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 17 page www.ti.com FEATURES CLR 3 2 5 8 1 CLK VCC D GND DCT PACKAGE (TOP VIEW) YEP OR YZP PACKAGE (BOTTOM VIEW) DCU PACKAGE (TOP VIEW) 3 2 4 5 1 CLK VCC PRE D GND D GND VCC Q Q See mechanical drawings for dimensions. 2 5 3 4 8 Q CLR Q Q PRE Q 4 6 7 6 7 8 6 1 7 CLK CLR PRE DESCRIPTION/ORDERING INFORMATION SN74AUP1G74 LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET SCES644A – MARCH 2006 – REVISED SEPTEMBER 2006 • Available in the Texas Instruments • Optimized for 3.3-V Operation NanoStar™ and NanoFree™ Packages • 3.6-V I/O Tolerant to Support Mixed-Mode • Low Static-Power Consumption: Signal Operation I CC = 0.9 µA Max • t pd = 4.3 ns Max at 3.3 V • Low Dynamic-Power Consumption: • Suitable for Point-to-Point Applications C pd = 4.3 pF Typ at 3.3 V • Latch-Up Performance Exceeds 100 mA Per • Low Input Capacitance: C i = 1.5 pF Typ JESD 78, Class II • Low Noise – Overshoot and Undershoot • ESD Performance Tested Per JESD 22 <10% of V CC – 2000-V Human-Body Model • I off Supports Partial-Power-Down Mode (A114-B, Class II) Operation – 200-V Machine Model (A115-A) • Schmitt-Trigger Action Allows Slow Input – 1000-V Charged-Device Model (C101) Transition and Better Switching Noise • ESD Protection Exceeds ±5000 V With Immunity at the Input (V hys = 250 mV Typ at Human-Body Model 3.3 V) • Wide Operating V CC Range of 0.8 V to 3.6 V The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP1G74YEPR 0.23-mm Large Bump – YEP _ _ _HS_ NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUP1G74YZPR –40 °C to 85°C 0.23-mm Large Bump – YZP (Pb-free) SSOP – DCT Reel of 3000 SN74AUP1G74DCTR H74_ _ _ VSSOP – DCU Reel of 3000 SN74AUP1G74DCUR H74_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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