Datenblatt-Suchmaschine für elektronische Bauteile |
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KMPC860SRZQ80D4 Datenblatt(PDF) 7 Page - Freescale Semiconductor, Inc |
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KMPC860SRZQ80D4 Datenblatt(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 80 page MPC860 Family Hardware Specifications, Rev. 7 Freescale Semiconductor 7 Power Dissipation 5 Power Dissipation Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1, where CPU frequency is twice the bus speed. NOTE Values in Table 5 represent VDDL-based power dissipation and do not include I/O power dissipation over VDDH. I/O power dissipation varies widely by application due to buffer current, depending on external circuitry. Table 4. MPC860 Thermal Resistance Data Rating Environment Symbol ZP MPC860P ZQ / VR MPC860P Unit Mold Compound Thickness 0.85 1.15 mm Junction-to-ambient 1 1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Natural convection Single-layer board (1s) RθJA 2 2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 34 34 °C/W Four-layer board (2s2p) RθJMA 3 3 Per JEDEC JESD51-6 with the board horizontal. 22 22 Airflow (200 ft/min) Single-layer board (1s) RθJMA 3 27 27 Four-layer board (2s2p) RθJMA 3 18 18 Junction-to-board 4 4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 14 13 Junction-to-case 5 5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the exposed pad without contact resistance. RθJC 6 8 Junction-to-package top 6 6 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. Natural convection ΨJT 2 2 Table 5. Power Dissipation (PD) Die Revision Frequency (MHz) Typical 1 1 Typical power dissipation is measured at 3.3 V. Maximum 2 2 Maximum power dissipation is measured at 3.5 V. Unit D.4 (1:1 mode) 50 656 735 mW 66 TBD TBD mW D.4 (2:1 mode) 66 722 762 mW 80 851 909 mW |
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