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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TSC2111IRGZTG4 Datenblatt(PDF) 4 Page - Texas Instruments |
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TSC2111IRGZTG4 Datenblatt(HTML) 4 Page - Texas Instruments |
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4 / 99 page  TSC2111 SLAS495− JUNE 2006 www.ti.com 4 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1), (2) UNITS AVDD1/2 to AVSS1/2 −0.3 V to 3.9 V DRVDD to DRVSS1/2 −0.3 V to 3.9 V BVDD to DRVSS1/2 −0.3 V to 4.5 V IOVDD to DVSS −0.3 V to 3.9 V Digital input voltage to DVSS −0.3 V to IOVDD + 0.3 V Analog input (except VBAT) voltage to AVSS1/2 −0.3 V to AVDD + 0.3 V VBAT input voltage to AVSS1/2 −0.3 V to 6 V AVSS1/2 to DRVSS1/2 to DVSS −0.1 V to 0.1 V AVDD1/2 to DRVDD −0.1 V to 0.1 V Operating temperature range −40 °C to 85°C Storage temperature range −65 °C to 105°C Junction temperature (TJ Max) 105 °C QFN package Power dissipation (TJ Max − TA)/θJA QFN package θJA Thermal impedance (with thermal pad soldered to board) 27 °C/W Lead temperature Infrared (15 sec) 240 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If the TSC2111 is used to drive high power levels to an 8-Ω load for extended intervals at an ambient temperature above 80°C, multiple vias should be used to electrically and thermally connect the thermal pad on the QFN package to an internal heat dissipating ground plane on the user’s PCB. |
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Ähnliche Beschreibung - TSC2111IRGZTG4 |
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