Datenblatt-Suchmaschine für elektronische Bauteile |
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TC2117-3.3EB Datenblatt(PDF) 8 Page - Microchip Technology |
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TC2117-3.3EB Datenblatt(HTML) 8 Page - Microchip Technology |
8 / 18 page TC2117 DS21665C-page 8 © 2006 Microchip Technology Inc. TABLE 4-2: THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN DDPAK PACKAGE Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: Maximum allowable power dissipation: In this example, the TC2117 dissipates a maximum of only 786 mW; below the allowable limit of 1.186W. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input volt- age limits. Copper Area (Topside)* Copper Area (Backside) Board Area Thermal Resistance ( θJA) 2500 sq mm 2500 sq mm 2500 sq mm 25°C/W 1000 sq mm 2500 sq mm 2500 sq mm 27°C/W 125 sq mm 2500 sq mm 2500 sq mm 35°C/W *Tab of device attached to topside copper. Given: VINMAX =5.0V ± 5% VOUTMIN = 3.3V ± 0.5% ILOADMAX = 400 mA TJMAX = 125°C TAMAX = 55°C θJA = 59°C/W (SOT-223) PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(5.0 x 1.05) – (3.3 x .995)] 400 x 10-3 = 786 mW PDMAX =(TJMAX – TAMAX) θJA = (125 – 55) 59 = 1.186W |
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