Datenblatt-Suchmaschine für elektronische Bauteile |
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FCCSP Datenblatt(PDF) 2 Page - Amkor Technology |
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FCCSP Datenblatt(HTML) 2 Page - Amkor Technology |
2 / 2 page fcCSP LAMINATE Process Highlights Die size (max) Pkg size - 1 mm Bump pitch (min) Pkg size - 1 mm In-line 150 µm Minimum array 250 µm Standard Materials Package substrate Hitachi FR5 E679 / BT Bump 63/37 Sn/Pb Encapsulant Epoxy mold compound Solder balls Eutectic SnPb Test Services • Program generation/conversion • Product engineering • Wafer sort • -55 °C to +165 °C test available • Burn-in Shipping JEDEC trays Tape and reel services data sheet With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. www.amkor.com Cross-section fcCSP Package Offering (units in mm) Body Size Pitch Ball Count Matrix 8 x 8 1.0 49 Full 9 x 9 1.0 64 Full 10 x 10 1.0 81 Full 11 x 11 1.0 100 Full 12 x 12 1.0 121 Full 13 x 13 1.0 144 Full 14 x 14 1.0 169 Full 15 x 15 1.0 196 Full 6 x 6 0.8 49 Full 7 x 7 0.8 64 Full 8 x 8 0.8 64 Full 8 x 8 0.8 81 Full 9 x 9 0.8 100 Full 10 x 10 0.8 144 Full 11 x 11 0.8 169 Full 12 x 12 0.8 196 Full 3 x 3 0.5 25 Full 4 x 4 0.5 36 Full 5 x 5 0.5 48 2 Row 5 x 5 0.5 64 Full 6 x 6 0.5 64 2 Row 6 x 6 0.5 84 3 Row 7 x 7 0.5 80 2 Row 7 x 7 0.5 108 3 Row 8 x 8 0.5 96 2 Row 8 x 8 0.5 132 3 Row 9 x 9 0.5 156 3 Row 10 x 10 0.5 180 3 Row Configuration Options: fcBGA (Flip Chip BGA): Moderate routing density, lowest cost flip chip package in intermediate ball counts. Bare die or Single Piece Lid. Qualified with both BU and 4L thin core substrates. Ball Count range is 256 - 1900 and Body Size range is 17 - 45 mm. Ceramic fcBGA (Ceramic Flip Chip BGA): Alumina or HiTCE flip chip packages with BGA, LGA, or SCI interconnect format. Capability for high layer count enables most flexible format for different ground and power planes. Available in bare die, AISiC Lid, or low cost Flat Lid. Qualified in body sizes ti 45 mm HiTCE (BGA), 45 mm alumina (SCI) and 31 mm alumina (BGA). Applications: The fcCSP package is targeted to high-performance workstations, servers, data communication products, internet routers and at high frequency and RF packaging applications where electrical performance is critical. The elimination of wirebond loops allows for a low inductance connection to the die, while the increased routing density enables optimized electrical paths for critical high frequency signal lines. The fcCSP is also an attractive option for portable and handheld electronics where, in addition to performance, package size is critical. Ceramic fcBGA |
Ähnliche Teilenummer - FCCSP |
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Ähnliche Beschreibung - FCCSP |
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