Datenblatt-Suchmaschine für elektronische Bauteile |
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74LVTH162374MTD Datenblatt(PDF) 1 Page - Fairchild Semiconductor |
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74LVTH162374MTD Datenblatt(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page tm July 2007 ©2000 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LVTH162374 Rev. 1.0.0 74LVTH162374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs and 25 Ω Series Resistors in the Outputs Features ■ Input and output interface capability to systems at 5V VCC ■ Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs ■ Live insertion/extraction permitted ■ Power Up/Power Down high impedance provides glitch-free bus loading ■ Outputs include equivalent series resistance of 25 Ω to make external termination resistors unnecessary and reduce overshoot and undershoot ■ Functionally compatible with the 74 series 16374 ■ Latch-up performance exceeds 500mA ■ ESD performance: – Human-body model > 2000V – Machine model > 200V – Charged-device model > 1000V ■ Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) General Description The LVTH162374 contains sixteen non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. A buffered clock (CP) and Output Enable (OE) are com- mon to each byte and can be shorted together for full 16-bit operation. The LVTH162374 is designed with equivalent 25 Ω series resistance in both the HIGH and LOW states of the output. This design reduces line noise in applications such as memory address drivers, clock drivers, and bus transceivers/transmitters. The LVTH162374 data inputs include bushold, eliminat- ing the need for external pull-up resistors to hold unused inputs. These flip-flops are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVTH162374 is fabri- cated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintain- ing a low power dissipation. Ordering Information Notes: 1. BGA package available in Tape and Reel only. Order Number Package Number Pb-Free Package Description Supplied As 74LVTH162374GX(1) BGA54A (Preliminary) Yes 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Tape and Reel 74LVTH162374MEA MS48A Yes 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Tubes 74LVTH162374MEX MS48A Yes 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Tape and Reel 74LVTH162374MTD MTD48 Yes 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Tubes 74LVTH162374MTX MTD48 Yes 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Tape and Reel |
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