Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74AUC2G53DCURE4 Datenblatt(PDF) 1 Page - Texas Instruments |
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SN74AUC2G53DCURE4 Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 20 page www.ti.com FEATURES DCT OR DCU PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 COM INH GND GND VCC Y1 Y2 A 4 3 2 1 5 6 7 8 GND GND INH COM A Y2 Y1 VCC YZP PACKAGE (BOTTOM VIEW) DESCRIPTION/ORDERING INFORMATION SN74AUC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER SCES484B – AUGUST 2003 – REVISED JANUARY 2007 • Available in the Texas Instruments NanoFree™ Package • Operates at 0.8 V to 2.7 V • Sub-1-V Operable • Low Power Consumption, 10 µA at 2.7 V • High On-Off Output Voltage Ratio • High Degree of Linearity • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC operation. The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUC2G53YZPR _ _ _U4_ 0.23-mm Large Bump – YZP (Pb-free) –40°C to 85°C SSOP – DCT Reel of 3000 SN74AUC2G53DCTR U53_ _ _ VSSOP – DCU Reel of 3000 SN74AUC2G53DCUR U53_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE CONTROL ON INPUTS CHANNEL INH A L L Y1 L H Y2 H X None Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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