Datenblatt-Suchmaschine für elektronische Bauteile |
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STA240 Datenblatt(PDF) 4 Page - STMicroelectronics |
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STA240 Datenblatt(HTML) 4 Page - STMicroelectronics |
4 / 6 page Package information STA240 4/6 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LBGA 288 mechanical data & package dimensions OUTLINE AND MECHANICAL DATA Ref. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.700 0.0669 A1 0.270 0.0106 A2 1.085 0.0427 A3 0.300 0.0118 A4 0.800 0.0315 b 0.450 0.500 0.550 0.0177 0.0197 0.0217 D 18.800 19.000 19.200 0.7402 0.7480 0.7559 D1 17.000 0.6693 e 1.000 0.0394 E 18.800 19.000 19.200 0.7402 0.7480 0.7559 E1 17.000 0.6693 F 1.000 0.0394 ddd 0.200 0.0079 eee 0.250 0.0098 fff 0.100 0.0039 LBGA288 (19x19x1.70) Low Profile Ball Grid Array 7131786 C Bottom view |
Ähnliche Teilenummer - STA240 |
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Ähnliche Beschreibung - STA240 |
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