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74LVC2G241GM Datenblatt(PDF) 2 Page - NXP Semiconductors |
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74LVC2G241GM Datenblatt(HTML) 2 Page - NXP Semiconductors |
2 / 17 page 74LVC2G241_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 5 October 2007 2 of 17 NXP Semiconductors 74LVC2G241 Dual buffer/line driver; 3-state 3. Ordering information 4. Marking 5. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC2G241DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC2G241DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74LVC2G241GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm SOT833-1 74LVC2G241GM −40 °C to +125 °C XQFN8 plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm SOT902-1 Table 2. Marking Type number Marking code 74LVC2G241DP V241 74LVC2G241DC V41 74LVC2G241GT V41 74LVC2G241GM V41 Fig 1. Logic symbol Fig 2. IEC logic symbol 001aaa409 1OE 1Y 1 26 1A 2OE 2Y 7 53 2A 001aaa408 1 EN1 EN2 1 2 6 2 7 3 5 |
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