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KZ2W330LT Datenblatt(PDF) 10 Page - DB Lectro Inc

Teilenummer KZ2W330LT
Bauteilbeschribung  CHIP TYPE, EXTRA LOW IMPEDANCE
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Hersteller  DBLECTRO [DB Lectro Inc]
Direct Link  http://www.dblectro.com
Logo DBLECTRO - DB Lectro Inc

KZ2W330LT Datenblatt(HTML) 10 Page - DB Lectro Inc

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LEAD FREE REFLOW SOLDERING CONDITION
(Applicable to Chip Type Aluminum Electrolytic Capacitors)
Recommended Conditions for Reflow Soldering
(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and
vapor heat transfer systems (VPS) are not recommended.
(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30
minutes must be layout between each time.
(3) For lead-free type reflow soldering, please observe proper conditions below:
a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;
b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed
tL (second);
c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C
of actual peak temperature shall not exceed tp (second).
Classification Reflow Profile
*1. Average ramp-up rate is 3
/second max.
*2. Ramp-down rate is 6
/second max.
*3. Time from 25
to peak temperature is 8 minutes max.
tp
20 0
25
21 7
Tp
15 0
t L
25 t o Peak * 3
Ramp-down
Ramp-up *1
*2
P reheat 180 s ec Max
Ti m e
Critical Zone
217t oTp
Allowable Range of Peak Temperature
Size
Thickness (mm)
Volume (mm
3)
Tp(°C)
tL (second)
tp (second)
4~ 6.3,
8 6.2L
2.5
<350
250±0
90
5
8 10.5L
2.5
350~2000
240±0
90
5
10 10.5L/13.5L
2.5
350~2000
235±0
60
5
12.5,
16
2.5
>2000
230±0
30 (20*)
5
Re: (20*) is special for mid-to-high voltage which is HU series.
Recommended Land Size (Unit: mm)
Size
ab
c
4
1.6
2.6
1.6
5
1.6
3.0
1.6
6.3
1.6
3.5
1.6
8×6.2L
2.1
4.5
1.6
8×10.5L
3.0
3.5
2.5
10
4.0
4.0
2.5
12.5
4.0
5.7
3.0
16×16.5/21.5
6.0
6.5
3.5
DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com


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