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UPC277MP5-KAA-E1-A Datenblatt(PDF) 8 Page - NEC

Teilenummer UPC277MP5-KAA-E1-A
Bauteilbeschribung  BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY DUAL COMPARATORS WITH SMALL PACKAGE
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Hersteller  NEC [NEC]
Direct Link  http://www.nec.com/
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UPC277MP5-KAA-E1-A Datenblatt(HTML) 8 Page - NEC

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Data Sheet G17934EJ3V0DS
8
μPC277GR-9LG, μPC277MP-KAA, μPC393GR-9LG
PRECAUTIONS FOR USE
O The process of unused circuits
If there is an unused circuit, the following connection is recommended.
Process example of unused circuits
V+
V
V
OUT
(open)
+
To potentials within the range of
common-mode input voltage (VICM)
O Ratings of input/output pin voltage
When the voltage of input/output pin exceeds the absolute maximum rating, it may cause degradation of
characteristics or damages, by a conduction of a parasitic diode within an IC. In addition, when the input/output pin
may be lower than V, it is recommended to make a clump circuit by a diode whose forward voltage is low (e.g.:
Schottky diode) for protection.
O Range of common-mode input voltage
When the supply voltage does not meet the condition of electrical characteristics, the range of common-mode
input voltage is as follows.
VICM (TYP.): Vto V+
− 1.5 (V) (TA = 25°C)
During designing, temperature characteristics for use with allowance.
O Range of Input Current
The “Input Bias Current [IB]” of the electric feature specification list is specified in accordance with the operation
amplifier. It is an average value of the current that flows in the
+input pin [IN] and the −input pin [II] when the
differential amplified circuit of an input stage is balanced (negative feedback is provided).
Therefore, because the differential amplified circuit of the input stage will not be balanced during comparison
(when comparator is active), the input current will flow, with twice the amount of current, to a pin with low potential.
O Handling of ICs
When stress is added to ICs due to warpage or bending of a board, the characteristic fluctuates due to
piezoelectric effect. Therefore, pay attention to warpage or bending of a board.
<R>


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