Datenblatt-Suchmaschine für elektronische Bauteile |
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FAN50FC3 Datenblatt(PDF) 5 Page - Fairchild Semiconductor |
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FAN50FC3 Datenblatt(HTML) 5 Page - Fairchild Semiconductor |
5 / 21 page © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN50FC3 Rev. 1.0.0 5 of 21 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit Supply Voltage, VCC -0.3 +15 V FBRTN -0.3 +0.3 V RAMPADJ, PWM3 -0.3 VCC +0.3 V SW1 – SW3 -10 +25 V All Other Inputs and Outputs -0.3 +5.5 V TJ Operating Junction Temperature 0 +125 °C TSTG Storage Temperature -65 +150 °C TLS Lead Soldering Temperature (10 Seconds) 300 °C TLI Lead Infrared Temperature (15 Seconds) 260 °C θJA Thermal Resistance, Junction-to-Ambient (1) 45 °C/W Note: 1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Typ. Max. Unit VCC Supply Voltage VCC to GND 9.6 12.0 14.4 V TA Ambient Temperature 0 +85 °C |
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Ähnliche Beschreibung - FAN50FC3 |
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