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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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ISL59451IRZ-T7 Datenblatt(PDF) 11 Page - Intersil Corporation |
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ISL59451IRZ-T7 Datenblatt(HTML) 11 Page - Intersil Corporation |
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11 / 17 page  11 FN6253.0 September 24, 2007 FIGURE 31. SMALL SIGNAL GAIN vs FREQUENCY vs CL INTO 75 Ω LOAD, GAIN = 2 FIGURE 32. LARGE SIGNAL GAIN vs FREQUENCY vs CL INTO 75 Ω LOAD, GAIN = 2 FIGURE 33. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 34. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves VCC = +5V, RL = 150Ω to GND, TA = +25°C, unless otherwise specified. (Continued) -20 -15 -10 -5 0 5 0.1k 1M 10M 100M 1G 10G FREQUENCY (Hz) CL = 7.4pF VIN = 100mVP-P CL = 0.6pF -20 -15 -10 -5 0 5 0.1k 1M 10M 100M 1G 10G FREQUENCY (Hz) CL = 7.4pF VIN = 700mVP-P CL = 0.6pF JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 2.857W θJA = 35°C/W QFN32 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1.2 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 θJA = 125°C/W QFN32 758mW ISL59451 |
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Ähnliche Beschreibung - ISL59451IRZ-T7 |
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