ULTRACHIP
High-Voltage Mixed-Signal IC
©1999 ~ 2007
2
ES Specifications
ORDERING INFORMATION
GOLD BUMPED DIE
Part Number
MTP
I
2C
Description
UC1697vGAA
Yes
No
Gold bumped die, with MTP function.
General Notes
APPLICATION INFORMATION
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing. There is no post
waffle saw/pack testing performed on individual die. Although the latest processes are utilized for wafer sawing and die
pick-&-place into waffle pack carriers, UltraChip has no control of third party procedures in the handling, packing or
assembly of the die. Accordingly, it is the responsibility of the customer to test and qualify their applications in which the
die is to be used. UltraChip assumes no liability for device functionality or performance of the die or systems after
handling, packing or assembly of the die.
MTP LIGHT & ESD SENSITIVITY
The MTP memory cell is sensitive to photon excitation and ESD. Under extended exposure to strong ambient light, or
when TST4 pin is exposed to ESD strikes, the MTP cells can lose its content before the specified memory retention time
span. The system designer is advised to provide proper light & ESD shields to realize full MTP content retention
performance.
LIFE SUPPORT APPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.
CONTENT DISCLAIMER
UltraChip believes the information contained in this document to be accurate and reliable. However, it is subject to change
without notice. The information and data provided herein is for reference only. No responsibility is assumed by UltraChip
for the use of information contained in this datasheet. Always contact UltraChip for commit to mass production for the
latest product information and operation parameters.
CONTACT INFORMATION
UltraChip Inc. (Headquarter)
2F, No. 70, Chowtze Street,
Nei Hu District, Taipei 114,
Taiwan, R. O. C.
Tel: +886 (2) 8797-8947
Fax: +886 (2) 8797-8910
Sales e-mail: sales@ultrachip.com
Web site: http://www.ultrachip.com