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ADXL001-250 Datenblatt(PDF) 4 Page - Analog Devices |
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ADXL001-250 Datenblatt(HTML) 4 Page - Analog Devices |
4 / 10 page ADXL001 Preliminary Technical Data This information applies to an ongoing development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no obligation regarding future manufacturing unless otherwise agreed to in writing. Patents pending. Rev. PrA | Page 4 of 10 tP tL tPEAK tS PREHEAT CRITICAL ZONE TL TO TP TIME (t) RAMP-DOWN RAMP-UP TSMIN TSMAX TP TL Figure 3. Recommended Soldering Profile Table 2. Recommended Soldering Profile Profile Feature Sn63/Pb37 Pb-Free Average Ramp Rate (TL to TP) 3°C/s maximum 3°C/s maximum Preheat Minimum Temperature (TSMIN) 100°C 150°C Maximum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX), ts 60 sec to 120 sec 60 sec to 150 sec TSMAX to TL Ramp-Up Rate 3°C/s 3°C/s Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) 183°C 217°C Time (tL) 60 sec to 150 sec 60 sec to 150 sec Peak Temperature (TP) 240°C + 0°C/−5°C 260°C + 0°C/−5°C Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec Ramp-Down Rate 6°C/s maximum 6°C/s maximum Time 25°C to Peak Temperature (tPEAK) 6 minute maximum 8 minute maximum |
Ähnliche Teilenummer - ADXL001-250 |
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Ähnliche Beschreibung - ADXL001-250 |
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