Datenblatt-Suchmaschine für elektronische Bauteile |
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SMBYW02 Datenblatt(PDF) 3 Page - STMicroelectronics |
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SMBYW02 Datenblatt(HTML) 3 Page - STMicroelectronics |
3 / 5 page 0.0 0.4 0.8 1.2 1.6 2.0 2.4 0.0 0.5 1.0 1.5 2.0 2.5 =0.05 =0.1 =0.2 =0.5 T =tp/T tp IF(av)(A) PF(av)(W) =1 Fig. 1: Low frequency power losses versus average current. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 P=0.5W T I M =tp/T tp IM(A) P=1.5W P=2.5W Fig. 2: Peak current versus form factor. 0.001 0.01 0.1 1 10 0.01 0.1 1 Zth(j-c) (tp. ) K= Rth(j-c) =0 . 5 =0 . 2 =0 . 1 Singl e puls e tp(s) T =tp/ T tp K Fig. 4: Relative variation of thermal impedance junction to lead versus pulse duration. 0.001 0.01 0.1 1 10 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 IM t =0.5 t(s) IM(A) Tc=25 C o Tc=70 C o Tc=100 C o Fig. 3: Non repetitive surge peak forward current versus overload duration. 0.1 1 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 I FM(A) VFM(V) Tl=100 C o 20 Fig. 5: Voltage drop versus forward current (maximum values). 0 20406080 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 T =tp/T tp =0.5 F(av)(A) I o Tamb( C) 1cm Cu 2 Rth(j-a)=75 C/W o Rth(j-a)=Rth(j-l) Fig. 6: Average current versus ambient temperature ( δ=0.5). SMBYW02-200 3/5 |
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