Datenblatt-Suchmaschine für elektronische Bauteile |
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STPS5L60 Datenblatt(PDF) 6 Page - STMicroelectronics |
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STPS5L60 Datenblatt(HTML) 6 Page - STMicroelectronics |
6 / 8 page Package information STPS5L60 6/8 2 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 16. Footprint, dimensions in mm (inches) Table 5. SMC dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b(1) 1. Dimensions b and c apply to plated leads 2.90 3.20 0.114 0.126 c(1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 E C L E2 E1 D A1 A2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14 |
Ähnliche Teilenummer - STPS5L60_08 |
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Ähnliche Beschreibung - STPS5L60_08 |
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