Datenblatt-Suchmaschine für elektronische Bauteile |
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TDA7495SA Datenblatt(PDF) 11 Page - STMicroelectronics |
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TDA7495SA Datenblatt(HTML) 11 Page - STMicroelectronics |
11 / 15 page TDA7495SA Thermal considerations 11/15 4 Thermal considerations In order to avoid the intervention of the thermal protection, it is important to choose an adequate heatsink. The parameters that influence the heatsink size are: " maximum dissipated power for the device (Pdmax) " maximum thermal resistance junction to case (RTh j-c) " maximum ambient temperature Tamb_max Example: For VCC = 20 V, RL = 8 Ω, RTh j-c = 5° C/W, Tamb_max = 50° C Pdmax = Number_of_channels * = 5 W For the heatsink, Figure 25 shows the power derating curve for the device. Figure 25. Power derating curve V cc 2 2 Π 2 R L ⋅ ----------------------- R Th j-c 150 T amb_max – P d max ---------------------------------------- R Th j-c – 100 5 ---------- 5 – 15 °C/W == = a) Infinite Heatsink b) 7 °C/ W c) 10 °C/ W (c) (a) (d) 0 5 10 15 20 040 80 120 160 Tamb (°C) a) Infinite Heatsink b) 7 °C/ W c) 10 °C/ W (c) (a) (b) 0 5 10 15 20 040 80 120 160 Tamb (°C) d) 3.3 °C/ W |
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