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STF23NM60N Datenblatt(PDF) 3 Page - STMicroelectronics

Teilenummer STF23NM60N
Bauteilbeschribung  N-channel 600 V - 0.150 廓 - 19 A - D2PAK - I2PAK - TO-220/FP TO-247, second generation MDmesh??Power MOSFET
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Direct Link  http://www.st.com
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STB23NM60N-STF/I23NM60N-STP23NM60N-STW23NM60N
Electrical ratings
3/19
1
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
D²PAK/I²PAK
TO-220/TO-247
TO-220FP
VDS
Drain-source voltage (VGS=0)
600
V
VGS
Gate-source voltage
± 25
V
ID
Drain current (continuous) at TC = 25 °C
19
19 (1)
1.
Limited only by maximum temperature allowed
A
ID
Drain current (continuous) at TC = 100 °C
11.7
11.7 (1)
A
IDM
(2)
2.
Pulse width limited by safe operating area
Drain current (pulsed)
76
76 (1)
A
PTOT
Total dissipation at TC = 25 °C
150
35
W
dv/dt (3)
3.
ISD ≤ 19 A, di/dt ≤400 A/µs, VDD =80% V(BR)DSS
Peak diode recovery voltage slope
15
V/ns
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t = 1 s; TC = 25 °C)
--
2500
V
Tstg
Storage temperature
-55 to 150
°C
Tj
Max. operating junction temperature
150
°C
Table 3.
Thermal data
Symbol
Parameter
TO-220
I²PAK
TO-247
D²PAK
TO-220FP
Unit
Rthj-case
Thermal resistance
junction-case max
0.83
3.6
°C/W
Rthj-amb
Thermal resistance
junction-amb max
62.5
50
--
62.5
°C/W
Rthj-pcb
Thermal resistance
junction-pcb max
--
--
--
30
--
°C/W
Tl
Maximum lead
temperature for
soldering purposes
300
°C


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