Datenblatt-Suchmaschine für elektronische Bauteile |
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TDA1170N Datenblatt(PDF) 7 Page - STMicroelectronics |
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TDA1170N Datenblatt(HTML) 7 Page - STMicroelectronics |
7 / 8 page MOUNTING INSTRUCTION Figure 5 : Example of P.C. Board Copper Area Used as Heatsink Figure 6 : Example of External heatsink Figure 7 : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus ”e” Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature During soldering the tab temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). The diagram of fig. 7 shows the maximum dissipa- ble power Ptot and the Rth j-amb as a function of the side ”e” of two equal square copper areas having a thicknessof 35 µ (1.4 mil). TDA1170N 7/8 |
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