Datenblatt-Suchmaschine für elektronische Bauteile |
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TDA7299 Datenblatt(PDF) 3 Page - STMicroelectronics |
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TDA7299 Datenblatt(HTML) 3 Page - STMicroelectronics |
3 / 7 page 3/7 TDA7299 *) Limited by the RTH of the package Figure 1. Application Circuit APPLICATION HINTS: For 12V supply and 8 Ω speaker application, its maximum power dissipation is about 1.8W. Assumming that max ambient temperature is 70°C. required thermal resistance of the device and heat dissipat- ing means must be equal to (150 - 70)/1.8 = 45°C/W. Junction to pin thermal resistance of the package is about 20°C/W. That means external heat sink of about 25°C/W is required. Cu ground plane of PCB can be used as heat dissipating means. Stand-By switches must be able to discharge Csvr current. Pot Transient Output Power *) Vi = 400mVp, THD < 2%, RL = 4Ω 2W THD Distortion PO = 1W 1 % SVR Supply Voltage Rejection Vripple = 150mVrms; Fripple = 1KHz 50 dB EI Input Noise Voltage Rg = 10K Ω; BW = 20Hz to 20KHz 1.5 5 µV Vsb Stand-By Enable Voltage 1 V ELECTRICAL CHARACTERISTICS (continued) (Tamb = 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.) Symbol Parameter Test Condition Min. Typ. Max. Unit IN SVR GND VS 100 µF VS=12V 470 µF OUT 8 Ω 0.1 µF 47 µF IN D94AU161A STAND-BY IN SVR GND VS 470 µF OUT 8 Ω 0.1 µF 47 µF IN STAND-BY |
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