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AD1989BJCPZ-RL Datenblatt(PDF) 8 Page - Analog Devices |
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AD1989BJCPZ-RL Datenblatt(HTML) 8 Page - Analog Devices |
8 / 20 page Rev. 0 | Page 8 of 20 | August 2008 AD1989B ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed below may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ENVIRONMENTAL CONDITIONS Ambient Temperature Rating TAMB = TCASE – (PD × θCA) TCASE = Case Temperature in °C PD = Power Dissipation in W θCA = Thermal Resistance (Case-to-Ambient) θJA = Thermal Resistance (Junction-to-Ambient) θJC = Thermal Resistance (Junction-to-Case) All measurements per EIA-JESD51 with 2S2P test board per EIA-JESD51-7. Parameter Rating Digital (DVDD) –0.30 V to +3.65 V Digital I/O (DVIO) –0.30 V to +3.65 V Digital GPIO (DVGPIO) –0.30 V to +3.65 V Analog (AVDD) –0.30 V to +3.65 V Input Current (Except Supply Pins) ±10.0 mA Analog Input Voltage (Signal Pins) –0.30 V to AVDD + 0.3 V Digital Input Voltage (Signal Pins) –0.30 V to DVIO + 0.3 V Ambient Temperature (Operating) 0°C to +70°C Storage Temperature –65°C to +150°C ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Table 3. Thermal Resistance Package θJA θJC θCA Unit LFCSP_VQ 47 15 32 °C/W |
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