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FAN2560 Datenblatt(PDF) 3 Page - Fairchild Semiconductor

Teilenummer FAN2560
Bauteilbeschribung  350mA Low-VIN LDO with Fast Transient Response
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Hersteller  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2560 • Rev. 1.0.0
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Units
VBAT, VIN, EN
-0.3
6.0
V
VOUT
Output Voltage
-0.3
VIN + 0.3V
V
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Human Body Model per JESD22-A114
3.5
ESD
Electrostatic Discharge
Protection Level
Charged Device Model per JESD22-C101
1.5
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Typ.
Max.
Units
VBAT
Bias Supply Range, (VOUT + 1.4V) < VBAT
2.9
5.5
V
VIN
Power Supply Range, (VIN < VBAT)
VOUT + VDO
VBAT
V
IOUT
Output Current
0
350
mA
Input Capacitor (Effective Capacitance)
0.7
1.0
μF
CIN
Equivalent Series Resistance (ESR)
0
300
mΩ
Output Capacitor (Effective Capacitance)
0.7
2.2
12.0
μF
COUT
Equivalent Series Resistance (ESR)
3
300
mΩ
TA
Operating Ambient Temperature Range
-40
+85
°C
TJ
Operating Junction Temperature Range
-40
+125
°C
Thermal Properties
Symbol
Parameter
Min.
Typ.
Max.
Units
ΘJA
Junction-to-Ambient Thermal Resistance
180
(1)
°C/W
Note
:
1
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with
four-layer boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed
junction temperature TJ(max) at a given ambient temperature TA.


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