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TPA0242 Datenblatt(PDF) 14 Page - Texas Instruments |
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TPA0242 Datenblatt(HTML) 14 Page - Texas Instruments |
14 / 29 page TPA0242 STEREO 2-W AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL AND MUX CONTROL SLOS287 – NOVEMBER 1999 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 THERMAL INFORMATION The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 29) to provide an effective thermal contact between the IC and the PWB. Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages, however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that severely limits the usable range of many high-performance analog circuits. The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal performance comparable to much larger power packages. The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can be reliably achieved. DIE Side View (a) End View (b) Bottom View (c) DIE Thermal Pad Figure 29. Views of Thermally Enhanced PWP Package |
Ähnliche Teilenummer - TPA0242 |
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Ähnliche Beschreibung - TPA0242 |
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