Datenblatt-Suchmaschine für elektronische Bauteile |
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SI-3025KM Datenblatt(PDF) 4 Page - Allegro MicroSystems |
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SI-3025KM Datenblatt(HTML) 4 Page - Allegro MicroSystems |
4 / 12 page 7 sReference Data Copper Foil Area-Thermal Resistance Copper Foil Area-Power Dissipation • Obtaining Junction Temperature Temperature of lead part of GND terminal: Measure TC with thermocouple. Substitute value to the following for- mula to obtain the junction temperature Tj=PD × θj–C + TC ( θj–C = 6°C/W) qSI-3000KM Series Case temperature measurement point 10 100 1000 40 50 60 70 80 90 100 Copper Foil Area (mm2) Glass-epoxy substrate : 30 ×30mm Glass-epoxy substrate : 30 ×30mm 0 0.5 1 1.5 Ta=25 °C 40 °C 60 °C 85 °C 10 100 1000 Copper Foil Area (mm2) sExample of Soldering Pattern Design 5.88 0.8 0.47 1.27 6.1 6.0 2.4 2.5 (Unit : mm) |
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