Datenblatt-Suchmaschine für elektronische Bauteile |
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ADS8557IPMR Datenblatt(PDF) 2 Page - Texas Instruments |
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ADS8557IPMR Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 40 page ABSOLUTE MAXIMUM RATINGS (1) ADS8556 ADS8557 ADS8558 SBAS404A – OCTOBER 2006 – REVISED AUGUST 2009 ............................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) RESOLUTION PACKAGE- PACKAGE ORDERING TRANSPORT PRODUCT (Bits) LEAD DESIGNATOR NUMBER MEDIA, QUANTITY ADS8556IPM Tray, 160 ADS8556I 16 LQFP-64 PM ADS8556IPMR Tape and Reel, 1000 ADS8557IPM Tray, 160 ADS8557I 14 LQFP-64 PM ADS8557IPMR Tape and Reel, 1000 ADS8558IPM Tray, 160 ADS8558I 12 LQFP-64 PM ADS8558IPMR Tape and Reel, 1000 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range, unless otherwise noted. ADS8556, ADS8557, ADS8558 UNIT Supply voltage, HVDD to AGND –0.3 to +18 V Supply voltage, HVSS to AGND –18 to +0.3 V Supply voltage, AVDD to AGND –0.3 to +6 V Supply voltage, BVDD to BGND –0.3 to +6 V Analog input voltage HVSS – 0.3 to HVDD + 0.3 V Reference input voltage with respect to AGND AGND – 0.3 to AVDD + 0.3 V Digital input voltage with respect to BGND BGND – 0.3 to BVDD + 0.3 V Ground voltage difference AGND to BGND ±0.3 V Input current to all pins except supply –10 to +10 mA Maximum virtual junction temperature, TJ +150 °C Human body model (HBM) ±2000 V JEDEC standard 22, test method A114-C.01, all pins ESD ratings Charged device model (CDM) ±500 V JEDEC standard 22, test method C101, all pins (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): ADS8556 ADS8557 ADS8558 |
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