Datenblatt-Suchmaschine für elektronische Bauteile |
|
NBXSPA008LNHTAG Datenblatt(PDF) 5 Page - ON Semiconductor |
|
NBXSPA008LNHTAG Datenblatt(HTML) 5 Page - ON Semiconductor |
5 / 6 page NBXSPA008 http://onsemi.com 5 Table 7. RELIABILITY COMPLIANCE Parameter Standard Method Shock Mechanical MIL−STD−833, Method 2002, Condition B Solderability Mechanical MIL−STD−833, Method 2003 Vibration Mechanical MIL−STD−833, Method 2007, Condition A Solvent Resistance Mechanical MIL−STD−202, Method 215 Resistance to Soldering Heat Mechanical MIL−STD−203, Method 210, Condition I or J Thermal Shock Environment MIL−STD−833, Method 1001, Condition A Moisture Resistance Environment MIL−STD−833, Method 1004 Figure 4. Typical Termination for Output Driver and Device Evaluation Driver Device Receiver Device CLK D CLK D Zo = 50 W Zo = 50 W 100 W NBXSPA008 260 217 175 150 Temperature (°C) temp. 260°C 20 − 40 sec. max. Time 60180 sec. 3°C/sec. max. cooling 6°C/sec. max. 60150 sec. reflow peak pre−heat ramp−up Figure 5. Recommended Reflow Soldering Profile |
Ähnliche Teilenummer - NBXSPA008LNHTAG |
|
Ähnliche Beschreibung - NBXSPA008LNHTAG |
|
|
Link URL |
Privatsphäre und Datenschutz |
ALLDATASHEETDE.COM |
War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |