Datenblatt-Suchmaschine für elektronische Bauteile |
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LA38B-69-G-1-PF Datenblatt(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA38B-69-G-1-PF Datenblatt(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard Description Reliability Test: Test Item Test Condition The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. High Temperature Storage Test Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Page 5/5 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 PART NO. LA38B-69/G-1-PF |
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